KEYNOTE: Automotive Semiconductor Quality – An OEM Perspective
Speaker: Dr. Stefan Simon, Audi, Ingolstadt (Germany)
Session 1: Closing the gap for full understanding of the thermal movement during electrical wafer test
Speakers: Walter Seitz, Sandro Reich, Harald Berger, Bosch, Reutlingen (Germany)
Session 2: Temperature accuracy under extreme power – test for high current automotive and industrial semiconductors
Speaker: Klemens Reitinger, ERS electronic, München (Germany)
Session 3: What We Have Learned Testing Of The Copper Pillar Wafers On The Large Area At High-temperature
Speaker: Swen Harder, FEINMETALL, Herrenberg (Germany)
Session 4: Advances in opto-electronical probe card technology for high-volume wafer level test of photonic integrated circuits
Speaker: Dr. Armin Grundmann, Jenoptik, Jena (Germany)
Session 5: “TBD”(Wafer Level Test during Burn-In on compound semiconductors with a focus on laser and silicon photonics laser)
Speaker: AEHR Test Systems (USA)
Panel Discussion: “Dirty Talk On Probing”
Speakers: Dr. Rainer Gaggl, Cooper Smith, Masatomo Takahashi, Dr. Oliver Nagler
KEYNOTE: Automation and Digitalization in the Semiconductor Production
Speaker: Dr. Harald Kuhn, Infineon Technologies, Regensburg (Germany)
Session 7: The future of probe card automation. Ready for Industry 4.0
Speaker: Stefan Thurmaier, Turbodynamics, Stephanskirchen (Germany)
Session 8: Use of Resource Sharing Techniques to Increase Parallel Test and Test Coverage in Wafer Test
Speaker: Dr. Michael Huebner, FormFactor, München (Germany)
Session 9: Complete Probe Card Solutions For RF Millimeter Waves Applications
Speaker: Alessandro Antonioli, Technoprobe (Italy)