KEYNOTE: Automotive Semiconductor Quality – An OEM Perspective

Speaker: Dr. Stefan Simon, Audi, Ingolstadt (Germany)

Session 1: Closing the gap for full understanding of the thermal movement during electrical wafer test

Speakers: Walter Seitz, Sandro Reich, Harald Berger, Bosch, Reutlingen (Germany)

Session 2: Temperature accuracy under extreme power – test for high current automotive and industrial semiconductors

Speaker: Klemens Reitinger, ERS electronic, München (Germany)

Session 3: What We Have Learned Testing Of The Copper Pillar Wafers On The Large Area At High-temperature

Speaker: Swen Harder, FEINMETALL, Herrenberg (Germany)

Session 4: Advances in opto-electronical probe card technology for high-volume wafer level test of photonic integrated circuits

Speaker: Dr. Armin Grundmann, Jenoptik, Jena (Germany)

Session 5: “TBD”(Wafer Level Test during Burn-In on compound semiconductors with a focus on laser and silicon photonics laser)

Speaker: AEHR Test Systems (USA)

Panel Discussion: “Dirty Talk On Probing”

Speakers: Dr. Rainer Gaggl, Cooper Smith, Masatomo Takahashi, Dr. Oliver Nagler

KEYNOTE: Automation and Digitalization in the Semiconductor Production

Speaker: Dr. Harald Kuhn, Infineon Technologies, Regensburg (Germany)

Session 7: The future of probe card automation. Ready for Industry 4.0

Speaker: Stefan Thurmaier, Turbodynamics, Stephanskirchen (Germany)

Session 8: Use of Resource Sharing Techniques to Increase Parallel Test and Test Coverage in Wafer Test

Speaker: Dr. Michael Huebner, FormFactor, München (Germany)

Session 9: Complete Probe Card Solutions For RF Millimeter Waves Applications

Speaker: Alessandro Antonioli, Technoprobe (Italy)